Calcium-Modified Silk Adhesive as Coupling Medium for Next-Generation Ultrasound Patch Applications

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Publisher
IEEE
Issue Date
2020-07-22
Language
English
Citation

42nd Annual International Conferences of the IEEE Engineering in Medicine and Biology Society in conjunction with the 43rd Annual Conference of the Canadian Medical and Biological Engineering Society

URI
http://hdl.handle.net/10203/278538
Appears in Collection
EE-Conference Papers(학술회의논문)
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