A Thermal-aware Optimization Framework for ReRAM-based Deep Neural Network Acceleration

Cited 10 time in webofscience Cited 7 time in scopus
  • Hit : 131
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorShin, Hyeinko
dc.contributor.authorKang, Myeongguko
dc.contributor.authorKim, Lee-Supko
dc.date.accessioned2020-11-30T09:50:17Z-
dc.date.available2020-11-30T09:50:17Z-
dc.date.created2020-11-30-
dc.date.created2020-11-30-
dc.date.issued2020-11-
dc.identifier.citation39th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2020-
dc.identifier.issn1933-7760-
dc.identifier.urihttp://hdl.handle.net/10203/277768-
dc.description.abstractResistive RAM (ReRAM) is widely regarded as a promising platform for deep neural network (DNN) acceleration. However, the ReRAM device suffers from severe thermal problems that degrade the lifetime and inference accuracy of the ReRAM-based DNN accelerator. To address the issues, we propose a thermal-aware optimization framework for accelerating DNN on ReRAM (TOPAR). TOPAR includes 3-stage offline thermal optimization and online thermal-aware error compensation. Offline thermal optimization consists of thermal-aware weight decomposition, thermal-aware column reordering, and fine-grained weight adjustment to reduce the temperature of the ReRAM-based DNN accelerator. For online thermal-aware error compensation, we compensate conductance change according to the temperature variation. With TOPAR, the endurance degradation due to temperature rise improves up to 2.39×, and inference accuracy is preserved without harming the performance of the ReRAM-based DNN accelerator.-
dc.languageEnglish-
dc.publisherIEEE/ACM-
dc.titleA Thermal-aware Optimization Framework for ReRAM-based Deep Neural Network Acceleration-
dc.typeConference-
dc.identifier.wosid000671087100026-
dc.identifier.scopusid2-s2.0-85097939639-
dc.type.rimsCONF-
dc.citation.publicationname39th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2020-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationVirtual-
dc.identifier.doi10.1145/3400302.3415665-
dc.contributor.localauthorKim, Lee-Sup-
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 10 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0