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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits

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dc.contributor.authorHan, Hoonheeko
dc.contributor.authorCho, Byung-Jinko
dc.contributor.authorChoi, Rinoko
dc.contributor.authorJung, Seong-Ookko
dc.contributor.authorS. C. Songko
dc.contributor.authorChoi, Changhwanko
dc.contributor.authorChung, SungWooko
dc.date.accessioned2020-11-30T08:50:31Z-
dc.date.available2020-11-30T08:50:31Z-
dc.date.created2020-11-27-
dc.date.created2020-11-27-
dc.date.issued2020-12-15-
dc.identifier.citation66th IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)-
dc.identifier.urihttp://hdl.handle.net/10203/277756-
dc.languageEnglish-
dc.publisherIEEE-
dc.titleLow Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits-
dc.typeConference-
dc.identifier.scopusid2-s2.0-85102961994-
dc.type.rimsCONF-
dc.citation.publicationname66th IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationVirtual-
dc.identifier.doi10.1109/IEDM13553.2020.9372102-
dc.contributor.localauthorCho, Byung-Jin-
dc.contributor.nonIdAuthorHan, Hoonhee-
dc.contributor.nonIdAuthorChoi, Rino-
dc.contributor.nonIdAuthorJung, Seong-Ook-
dc.contributor.nonIdAuthorS. C. Song-
dc.contributor.nonIdAuthorChoi, Changhwan-
dc.contributor.nonIdAuthorChung, SungWoo-
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EE-Conference Papers(학술회의논문)
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