A Capacitance-to-Digital Converter with Differential Bondwire Accelerometer, On-chip Air Pressure and Humidity Sensor in 0.18 μm CMOS

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dc.contributor.authorPark, Sujinko
dc.contributor.authorLee, Geon-Hwiko
dc.contributor.authorOh, Seungminko
dc.contributor.authorCho, SeongHwanko
dc.date.accessioned2020-11-30T07:30:33Z-
dc.date.available2020-11-30T07:30:33Z-
dc.date.created2020-11-26-
dc.date.issued2020-01-13-
dc.identifier.citation25th Asia and South Pacific Design Automation Conference, ASP-DAC 2020, pp.3 - 4-
dc.identifier.urihttp://hdl.handle.net/10203/277743-
dc.description.abstractThis paper presents a sensor front-end for air pressure sensor, relative humidity (RH) sensor, and accelerometer in a standard CMOS process. For air pressure and RH, interdigitated top metals in air and polyimide are exploited respectively, which exhibit the change in dielectric constant. For acceleration, separation among three bondwires is exploited. These sensing transducers induce capacitance change that is quantized by a CDC based on a dual quantization architecture that employs a single-bit 1st-order Δ\∑ modulator and a 7-bit SAR ADC.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleA Capacitance-to-Digital Converter with Differential Bondwire Accelerometer, On-chip Air Pressure and Humidity Sensor in 0.18 μm CMOS-
dc.typeConference-
dc.identifier.scopusid2-s2.0-85083040756-
dc.type.rimsCONF-
dc.citation.beginningpage3-
dc.citation.endingpage4-
dc.citation.publicationname25th Asia and South Pacific Design Automation Conference, ASP-DAC 2020-
dc.identifier.conferencecountryCC-
dc.identifier.conferencelocationChina National Convention Center, Beijing-
dc.identifier.doi10.1109/ASP-DAC47756.2020.9045565-
dc.contributor.localauthorCho, SeongHwan-
dc.contributor.nonIdAuthorPark, Sujin-
dc.contributor.nonIdAuthorLee, Geon-Hwi-
dc.contributor.nonIdAuthorOh, Seungmin-
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EE-Conference Papers(학술회의논문)
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