DC Field | Value | Language |
---|---|---|
dc.contributor.author | Das, Dipjyoti | ko |
dc.contributor.author | Jeon, Sanghun | ko |
dc.date.accessioned | 2020-07-08T08:55:05Z | - |
dc.date.available | 2020-07-08T08:55:05Z | - |
dc.date.created | 2020-06-23 | - |
dc.date.created | 2020-06-23 | - |
dc.date.created | 2020-06-23 | - |
dc.date.issued | 2020-06 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.6, pp.2489 - 2494 | - |
dc.identifier.issn | 0018-9383 | - |
dc.identifier.uri | http://hdl.handle.net/10203/275357 | - |
dc.description.abstract | In this article, we report the fabrication of Zr-rich high-k ferroelectric hafnium zirconium oxide (HZO) capacitor with TiN as the top and bottom electrodes demonstrating an equivalent oxide thickness (EOT) of 5.7 angstrom and remanent polarization (P-r) of similar to 16 mu C/cm(2). High-k value and low EOT was achieved by utilizing multiphase region of HZO as well as high pressure post metallization annealing (HPPMA). Despite the high-k value of Zr-rich HZO films, the emergence of multiphase region at higher physical thickness when annealed using rapid thermal annealing (RTA) limits its EOT value. On the contrary, multiphase emerges at a smaller physical thickness in HPPMA due to the formation of more o-phase as revealed by grazing incidence X-ray diffractometer (GIXRD). The smaller physical thickness of HPPMA together with the demonstration of significantly higher dielectric constant (>50) by HZO in the vicinity of multiphase, was therefore, found to be very effective in reducing the EOT. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | High-k HfxZr1-xO2 Ferroelectric Insulator by Utilizing High Pressure Anneal | - |
dc.type | Article | - |
dc.identifier.wosid | 000538163700042 | - |
dc.identifier.scopusid | 2-s2.0-85085569084 | - |
dc.type.rims | ART | - |
dc.citation.volume | 67 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 2489 | - |
dc.citation.endingpage | 2494 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON ELECTRON DEVICES | - |
dc.identifier.doi | 10.1109/TED.2020.2985635 | - |
dc.contributor.localauthor | Jeon, Sanghun | - |
dc.contributor.nonIdAuthor | Das, Dipjyoti | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Equivalent oxide thickness (EOT) | - |
dc.subject.keywordAuthor | hafnium zirconium oxide (HZO) | - |
dc.subject.keywordAuthor | high pressure post metallization annealing (HPPMA) | - |
dc.subject.keywordAuthor | multiphase | - |
dc.subject.keywordAuthor | rapid thermal annealing (RTA) | - |
dc.subject.keywordPlus | EQUIVALENT OXIDE THICKNESS | - |
dc.subject.keywordPlus | MORPHOTROPIC PHASE-BOUNDARY | - |
dc.subject.keywordPlus | SOLID-SOLUTION SYSTEMS | - |
dc.subject.keywordPlus | DIELECTRIC-PROPERTIES | - |
dc.subject.keywordPlus | FILMS | - |
dc.subject.keywordPlus | CAPACITORS | - |
dc.subject.keywordPlus | MEMORY | - |
dc.subject.keywordPlus | NM | - |
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