A study of failure criteria for a crack in multilayer ceramic capacitors by ball drop test

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Measuring with strain gages has a limitation of consuming time to prepare for the experiment and attaching near the MLCCs, making it does not represent the physical quantities of the MLCCs itself. In this study, we propose a ‘failure criteria for a crack in MLCCs soldered on a Print-Circuit-Board by ball drop test’ based on the acceleration measured by Laser Doppler Vibrometers. By drawing a Shock Response Spectrum, we can find the dominant frequency for the failure of MLCCs. In addition, we present a suitable deformation form of the Print-Circuit-Board by using a high-speed camera.
Publisher
The international society for optics and photonics
Issue Date
2020-04-24
Language
English
Citation

SPIE Smart Structures + Nondestructive Evaluation 2020

DOI
10.1117/12.2558351
URI
http://hdl.handle.net/10203/275299
Appears in Collection
AE-Conference Papers(학술회의논문)
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