A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging

Abstract

For the development of electronic packaging products, the mixture of micron-filler and nano-filler was adopted to improve the electronic property of conductive adhesive. The porpose of the addition of micron-filler and nano-filler is to achieve a higher conductive property, so that the perfect conductive adhesive could be obtained by the optimized conductive fillers. The conductive filler composed of Cu powders coated by nano-Ag layer and silver nanowire and resin matrix were mixed to fabricate conductive adhesive. The conductive filler composed of Cu powder coated by nano-Ag layer and silver nanowire could reduce the bulk resistivity and percolation threshold of conductive adhesive. When the conductive adhesive was cured at 170 degrees C for 60min using Cu powder coated by nano-Ag layer and silver nanowire as conductive filler and the content of filler was 60wt.%, the bulk resistivity of the newly formed conductive adhesive was low to 6.53 x10-5 Omega.cm, while the shear strength of the adhesive was 5.36MPa.