DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, SY | ko |
dc.contributor.author | Wolf, J | ko |
dc.contributor.author | Gloor, H | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2008-01-11T09:15:17Z | - |
dc.date.available | 2008-01-11T09:15:17Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-05 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/2730 | - |
dc.description.abstract | The demand for Pb-free and high-density interconnection technology is rapidly growing. The electroplating-bumping method is a good approach to meet fine-pitch requirements, especially for high-volume production, because the volume change of patterned-solder bumps during reflow is not so large compared with the stencil-printing method. This paper proposes a Sn/3.5Ag Pb-free electroplating-bumping process for high-density Pb-free interconnects. It was found that a plated Sn/Ag bump becomes Sn/Ag/Cu by reflowing when Cu containing under bump metallurgy (UBM) is used. Another important issue for future flip-chip interconnects is to optimize the UBM system for high-density and Pb-free solder bumps. In this work, four UBM systems, sputtered TiW 0.2 mum/Cu 0.3 mum/electroplated Cu 5 mum, sputtered Cr 0.15 mum/Cr-Cu 0.3 mum/Cu 0.8 mum, sputtered NiV 0.2 mum/Cu 0.8 mum, and sputtered TiW 0.2 mum/NiV 0.8 mum, were investigated for interfacial reaction with electroplated Pb/63Sn and Sn/3.5Ag solder bumps. Both Cu-Sn and Ni-Sn intermetallic compound (IMC) growth were observed to spall-off from the UBM/solder interface when the solder-wettable layer is consumed during a liquid-state "reflow" process. This IMC-spalling mechanism differed depending on the barrier layer material. | - |
dc.description.sponsorship | The authors express their sincere appreciation to Herbert Reichl (Fraunhofer IZM) for the support of the KAIST-Fraunhofer IZM cowork program and to Hans Auer and Heinz Gloor (Unaxis Balzers) for the UBM processing. We extend special thanks to J.H. Kim (KAIST) for the assistance with the Thermo- Calc operation. This work was supported by the Center for Electronic Packaging Materials of the Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | MINERALS METALS MATERIALS SOC | - |
dc.subject | THIN-FILM METALLIZATION | - |
dc.subject | FLIP-CHIP TECHNOLOGY | - |
dc.subject | EUTECTIC SNPB | - |
dc.subject | INTERMETALLIC COMPOUNDS | - |
dc.subject | INTERFACIAL REACTIONS | - |
dc.subject | SOLDERING REACTION | - |
dc.subject | CU | - |
dc.subject | GROWTH | - |
dc.subject | ALLOY | - |
dc.subject | NI | - |
dc.title | (UBM)Under bump metallurgy study for Pb-free bumping | - |
dc.type | Article | - |
dc.identifier.wosid | 000175804600027 | - |
dc.identifier.scopusid | 2-s2.0-0036575442 | - |
dc.type.rims | ART | - |
dc.citation.volume | 31 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 478 | - |
dc.citation.endingpage | 487 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jang, SY | - |
dc.contributor.nonIdAuthor | Wolf, J | - |
dc.contributor.nonIdAuthor | Gloor, H | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | under bump metallurgy (UBM) | - |
dc.subject.keywordAuthor | flip-chip | - |
dc.subject.keywordAuthor | electroplating | - |
dc.subject.keywordAuthor | Pb free | - |
dc.subject.keywordAuthor | Sn/3.5Ag | - |
dc.subject.keywordAuthor | Pb/63Sn | - |
dc.subject.keywordAuthor | intermetallic compounds (IMC) | - |
dc.subject.keywordPlus | THIN-FILM METALLIZATION | - |
dc.subject.keywordPlus | FLIP-CHIP TECHNOLOGY | - |
dc.subject.keywordPlus | EUTECTIC SNPB | - |
dc.subject.keywordPlus | INTERMETALLIC COMPOUNDS | - |
dc.subject.keywordPlus | INTERFACIAL REACTIONS | - |
dc.subject.keywordPlus | SOLDERING REACTION | - |
dc.subject.keywordPlus | CU | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | ALLOY | - |
dc.subject.keywordPlus | NI | - |
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