DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, Jiyoung | ko |
dc.contributor.author | Lee, Sangryun | ko |
dc.contributor.author | Ryu, Byungki | ko |
dc.contributor.author | Ryu, Seunghwa | ko |
dc.date.accessioned | 2019-12-13T01:22:51Z | - |
dc.date.available | 2019-12-13T01:22:51Z | - |
dc.date.created | 2019-12-02 | - |
dc.date.created | 2019-12-02 | - |
dc.date.issued | 2019-12 | - |
dc.identifier.citation | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.144 | - |
dc.identifier.issn | 0017-9310 | - |
dc.identifier.uri | http://hdl.handle.net/10203/268778 | - |
dc.description.abstract | We obtained the analytical expression for the effective thermoelectric properties and dimensionless figure of merit of a composite with interfacial electrical and thermal resistances using a micromechanics-based homogenisation. For the first time, we derived the Eshelby tensor for a spherical inclusion as a function of the interfacial resistances and obtained the solutions of the effective Seebeck coefficient and the electrical and thermal conductivities of a composite, which were validated against finite-element analysis (FEA). Our analytical predictions well match the effective properties obtained from FEA with an inclusion volume fraction up to 15%. Because the effective properties were derived with the assumption of a small temperature difference, we discuss a heuristic method for obtaining the effective properties in the case where a thermoelectric composite is subjected to a large temperature difference. (C) 2019 Elsevier Ltd. All rights reserved. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.title | Investigation of effective thermoelectric properties of composite with interfacial resistance using micromechanics-based homogenisation | - |
dc.type | Article | - |
dc.identifier.wosid | 000494883300038 | - |
dc.identifier.scopusid | 2-s2.0-85072575768 | - |
dc.type.rims | ART | - |
dc.citation.volume | 144 | - |
dc.citation.publicationname | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | - |
dc.identifier.doi | 10.1016/j.ijheatmasstransfer.2019.118620 | - |
dc.contributor.localauthor | Ryu, Seunghwa | - |
dc.contributor.nonIdAuthor | Lee, Sangryun | - |
dc.contributor.nonIdAuthor | Ryu, Byungki | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Thermoelectricity | - |
dc.subject.keywordAuthor | Homogenisation | - |
dc.subject.keywordAuthor | Interfacial electrical resistance | - |
dc.subject.keywordAuthor | Interfacial thermal resistance | - |
dc.subject.keywordPlus | EFFECTIVE CONDUCTIVITY | - |
dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
dc.subject.keywordPlus | POLYMER COMPOSITES | - |
dc.subject.keywordPlus | FIGURE | - |
dc.subject.keywordPlus | MERIT | - |
dc.subject.keywordPlus | ENHANCEMENT | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | BEHAVIOR | - |
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