Effects of Anisotropic Conductive Films (ACFs) Types on Bending Reliability of Chip-In-Plastic (CIP) Package

Abstract

Chip-In-Plastic (CIP) package using APL(Anchoring Polymer Layer) ACFs are presented as a flexible display driver IC package suitable for high-definition OLED displays. In this paper, the effect of type of ACFs on bending reliability of CIP package is investigated. By optimizing the CIP package, better flexibility is achieved than the COP package.

And the conventional ACFs, the Nanofiber and APL ACFs were assembled in CIP to investigate electrical characteristics and bending reliability. As for electrical characteristics, unlike conventional ACFs, nanofiber and APL ACFs had 100% insulation characteristics. In bending reliability, the resistance increase rate after 100,000 cycle bending of 15 mm radius was 0.6% for APL ACFs, 0.9% for nanofiber ACF, 1.1% for Conventional ACFs, APL ACFs exhibited the most stable resistance change because APL ACFs had a high modulus of 1.8 GPa, resulting in less strain and less plastic strain Thus, CIP using APL ACFs is one of the most flexible display driver IC packages for high-definition OLED displays