Fabrication of high thermal conductivity composites using liquid metal = 액체 금속을 이용한 고방열 복합소재 제작

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As the recent trends for microelectronic devices have been higher integration and miniaturization, heat treatment of them also has become important. High thermal conductivity composite is commonly made of solid powders which have high thermal conductivity and polymer for good processibility. However, this composite had shown bad processibility as solid powder’s fraction had to be high to get high thermal conductivity. In this study, we made high thermal conductivity composite by using liquid metal, EGaIn instead of solid powder to achieve both high thermal conductivity and good processibility. By vortexing mixer, 90 vol % EGaIn high internal phase emulsion (HIPE) was made and thermal conductivity, rheological property and electric insulation of HIPE were assessed. The results suggest new concept of method for making high thermal conductivity composite and could show strength of EGaIn HIPE in accomplishing both high thermal conductivity and good processibility when it’s applied to real microelectronic devices.
Advisors
Choi, Siyoungresearcher최시영researcher
Description
한국과학기술원 :생명화학공학과,
Publisher
한국과학기술원
Issue Date
2018
Identifier
325007
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 생명화학공학과, 2018.2,[ii, 35 p. :]

Keywords

High thermal conductivity▼aComposites▼aLiquid metal▼aEmulsion▼aHigh internal phase emulsion; 고방열▼a복합소재▼a액체금속▼a에멀젼▼a고내부상 에멀젼

URI
http://hdl.handle.net/10203/266398
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=733881&flag=dissertation
Appears in Collection
CBE-Theses_Master(석사논문)
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