Conductive ink and paste for application of printed electronics on soft substrate

Abstract

Printed electronics, one of representing technology of solution process, is regarded as promising technology for replacing conventional lithography process in electronics industry. While lithography process are complex, time consuming multiple steps process and generating hazardous waste, printed electronics are low cost and mass productive process. These advantageous properties of printed electronics adapted to flexible electronics. In this dissertaion, overall objective is focusing on the conductive materials which is enabling low temperature process and their application by using solution process on the plastic substrate. Firstly, we synthesized oxide-free aluminum nanoparticles for lowering sintering temperature itself, because nanoparticles possess low melting temperature due to their high surface to volume ratio. Secondly, we studied effect of surface ligand to sintering temperature. We applied ligand exchange method to fabricate uniform silver nanoparticle thin film electrodes for improving the electrical properties and solve problems such as volume shrinkage after ligand exchange. Finally, we studied dissolvable metal pastes, which is consisted molybdenum, tungsten and zinc nanoparticles and several transient polymers.