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Results 1-1 of 1 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Characterization of closed-loop solder-line bonding for hermetic MEMS packaging = 사각고리형 금속 박막을 이용한 마이크로시스템의 밀봉 패키징 및 누설 특성 시험link

Kim, Seong-A; 김성아; Cho, Young-Ho; 조영호, 한국과학기술원, 2002

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