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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Noise Coupling of Through-Via in Silicon and Glass Interposer

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorManho Leeko
dc.contributor.authorJonghyun Choko
dc.contributor.authorJoohee Kimko
dc.contributor.authorJiseong Kimko
dc.date.accessioned2019-04-16T01:32:10Z-
dc.date.available2019-04-16T01:32:10Z-
dc.date.created2013-06-26-
dc.date.issued2012-05-29-
dc.identifier.citationECTC Conference-
dc.identifier.urihttp://hdl.handle.net/10203/259681-
dc.languageEnglish-
dc.publisherECTC Conference-
dc.titleNoise Coupling of Through-Via in Silicon and Glass Interposer-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameECTC Conference-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorManho Lee-
dc.contributor.nonIdAuthorJonghyun Cho-
dc.contributor.nonIdAuthorJoohee Kim-
dc.contributor.nonIdAuthorJiseong Kim-
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EE-Conference Papers(학술회의논문)
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