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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Contactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorHeegon Kimko
dc.contributor.authorSukjin Kimko
dc.contributor.authorChanghyun Chko
dc.contributor.authorDaniel H. Jungko
dc.contributor.authorJun So Pakko
dc.date.accessioned2019-04-15T23:51:25Z-
dc.date.available2019-04-15T23:51:25Z-
dc.date.created2013-06-26-
dc.date.created2013-06-26-
dc.date.created2013-06-26-
dc.date.issued2012-12-10-
dc.identifier.citation2012 IEEE Electrical Design of Advanced Package & Systems Symposium-
dc.identifier.urihttp://hdl.handle.net/10203/259165-
dc.languageEnglish-
dc.publisherEDAPS2012-
dc.titleContactless Wafer-Level TSV Connectivity Testing Method Using Magnetic Coupling-
dc.typeConference-
dc.identifier.wosid000317015500002-
dc.identifier.scopusid2-s2.0-84875520646-
dc.type.rimsCONF-
dc.citation.publicationname2012 IEEE Electrical Design of Advanced Package & Systems Symposium-
dc.identifier.conferencecountryCH-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorHeegon Kim-
dc.contributor.nonIdAuthorSukjin Kim-
dc.contributor.nonIdAuthorChanghyun Ch-
dc.contributor.nonIdAuthorDaniel H. Jung-
dc.contributor.nonIdAuthorJun So Pak-
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EE-Conference Papers(학술회의논문)
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