DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Joohee Kim | ko |
dc.contributor.author | Heegon Kim | ko |
dc.contributor.author | Jonghoon J. Kim | ko |
dc.contributor.author | Jun So Pak | ko |
dc.date.accessioned | 2019-04-15T23:51:22Z | - |
dc.date.available | 2019-04-15T23:51:22Z | - |
dc.date.created | 2013-06-26 | - |
dc.date.created | 2013-06-26 | - |
dc.date.created | 2013-06-26 | - |
dc.date.issued | 2012-12-10 | - |
dc.identifier.citation | 2012 IEEE Electrical Design of Advanced Package & Systems Symposium | - |
dc.identifier.uri | http://hdl.handle.net/10203/259163 | - |
dc.language | English | - |
dc.publisher | EDAPS2012 | - |
dc.title | Disconnection failure model and analysis of TSV-based 3D ICs | - |
dc.type | Conference | - |
dc.identifier.wosid | 000317015500043 | - |
dc.identifier.scopusid | 2-s2.0-84875516598 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2012 IEEE Electrical Design of Advanced Package & Systems Symposium | - |
dc.identifier.conferencecountry | CH | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Joohee Kim | - |
dc.contributor.nonIdAuthor | Heegon Kim | - |
dc.contributor.nonIdAuthor | Jonghoon J. Kim | - |
dc.contributor.nonIdAuthor | Jun So Pak | - |
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