DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Choi, Yongwon | ko |
dc.contributor.author | Shin, Jiwon | ko |
dc.date.accessioned | 2019-04-15T23:32:54Z | - |
dc.date.available | 2019-04-15T23:32:54Z | - |
dc.date.created | 2013-07-10 | - |
dc.date.issued | 2013-01-23 | - |
dc.identifier.citation | 2013 Pan Pacific Microelectronics Symposium | - |
dc.identifier.uri | http://hdl.handle.net/10203/259110 | - |
dc.language | English | - |
dc.publisher | 2013 Pan Pacific Microelectronics Symposium | - |
dc.title | 3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs) | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2013 Pan Pacific Microelectronics Symposium | - |
dc.identifier.conferencecountry | US | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Choi, Yongwon | - |
dc.contributor.nonIdAuthor | Shin, Jiwon | - |
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