Microsolder Ball Incorporated Nanofiber Anisotropic Conductive Adhesives (Microsolder/Nanofiber ACAs)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Suk, Kyoung-Lim | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2019-04-15T23:10:40Z | - |
| dc.date.available | 2019-04-15T23:10:40Z | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.created | 2013-06-25 | - |
| dc.date.issued | 2013-02-28 | - |
| dc.identifier.citation | 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.162 - 169 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/258957 | - |
| dc.language | English | - |
| dc.publisher | 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) | - |
| dc.title | Microsolder Ball Incorporated Nanofiber Anisotropic Conductive Adhesives (Microsolder/Nanofiber ACAs) | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000320594100019 | - |
| dc.identifier.scopusid | 2-s2.0-84878864494 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 162 | - |
| dc.citation.endingpage | 169 | - |
| dc.citation.publicationname | 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Suk, Kyoung-Lim | - |
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