DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ko, Y. | ko |
dc.contributor.author | Kim, M. | ko |
dc.contributor.author | Kim, Taek-Soo | ko |
dc.contributor.author | Bang, J. | ko |
dc.contributor.author | Lee, C. | ko |
dc.date.accessioned | 2019-04-15T18:30:22Z | - |
dc.date.available | 2019-04-15T18:30:22Z | - |
dc.date.created | 2014-01-14 | - |
dc.date.issued | 2013-10-06 | - |
dc.identifier.citation | 15th International Conference on Electronic Materials and Packaging | - |
dc.identifier.uri | http://hdl.handle.net/10203/257165 | - |
dc.language | English | - |
dc.publisher | Electronic Materials and Packaging | - |
dc.title | Evaluation on Property and Reliability of Micro-bump Joint between Si chip and Flexible Substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 15th International Conference on Electronic Materials and Packaging | - |
dc.identifier.conferencecountry | KO | - |
dc.contributor.localauthor | Kim, Taek-Soo | - |
dc.contributor.nonIdAuthor | Ko, Y. | - |
dc.contributor.nonIdAuthor | Kim, M. | - |
dc.contributor.nonIdAuthor | Bang, J. | - |
dc.contributor.nonIdAuthor | Lee, C. | - |
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