Modeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections

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dc.contributor.author김정호ko
dc.contributor.author김석진ko
dc.contributor.author정현석ko
dc.contributor.author김종훈ko
dc.contributor.author배범희ko
dc.contributor.author공선규ko
dc.contributor.author송치억ko
dc.date.accessioned2019-04-15T15:15:54Z-
dc.date.available2019-04-15T15:15:54Z-
dc.date.created2014-11-26-
dc.date.created2014-11-26-
dc.date.created2014-11-26-
dc.date.issued2014-05-08-
dc.identifier.citationIEEE Wireless Power Transfer Conference 2014(WPTC2014)-
dc.identifier.urihttp://hdl.handle.net/10203/254871-
dc.languageKorean-
dc.publisherIEEE Wireless Power Transfer Conference 2014(WPTC2014)-
dc.titleModeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections-
dc.typeConference-
dc.identifier.wosid000364197500068-
dc.identifier.scopusid2-s2.0-84904170973-
dc.type.rimsCONF-
dc.citation.publicationnameIEEE Wireless Power Transfer Conference 2014(WPTC2014)-
dc.identifier.conferencecountryKO-
dc.contributor.localauthor김정호-
dc.contributor.nonIdAuthor김석진-
dc.contributor.nonIdAuthor정현석-
dc.contributor.nonIdAuthor김종훈-
dc.contributor.nonIdAuthor배범희-
dc.contributor.nonIdAuthor공선규-
dc.contributor.nonIdAuthor송치억-
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