DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김정호 | ko |
dc.contributor.author | 김석진 | ko |
dc.contributor.author | 정현석 | ko |
dc.contributor.author | 김종훈 | ko |
dc.contributor.author | 배범희 | ko |
dc.contributor.author | 공선규 | ko |
dc.contributor.author | 송치억 | ko |
dc.date.accessioned | 2019-04-15T15:15:54Z | - |
dc.date.available | 2019-04-15T15:15:54Z | - |
dc.date.created | 2014-11-26 | - |
dc.date.created | 2014-11-26 | - |
dc.date.created | 2014-11-26 | - |
dc.date.issued | 2014-05-08 | - |
dc.identifier.citation | IEEE Wireless Power Transfer Conference 2014(WPTC2014) | - |
dc.identifier.uri | http://hdl.handle.net/10203/254871 | - |
dc.language | Korean | - |
dc.publisher | IEEE Wireless Power Transfer Conference 2014(WPTC2014) | - |
dc.title | Modeling of Electromagnetic Interference Shielding Materials in Wireless Power Transfer for Board-to-Board Level Interconnections | - |
dc.type | Conference | - |
dc.identifier.wosid | 000364197500068 | - |
dc.identifier.scopusid | 2-s2.0-84904170973 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE Wireless Power Transfer Conference 2014(WPTC2014) | - |
dc.identifier.conferencecountry | KO | - |
dc.contributor.localauthor | 김정호 | - |
dc.contributor.nonIdAuthor | 김석진 | - |
dc.contributor.nonIdAuthor | 정현석 | - |
dc.contributor.nonIdAuthor | 김종훈 | - |
dc.contributor.nonIdAuthor | 배범희 | - |
dc.contributor.nonIdAuthor | 공선규 | - |
dc.contributor.nonIdAuthor | 송치억 | - |
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