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1
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

2
손실 저감을 위해 분할된 도체를 가지는 인쇄 회로 기판형 무선충전 코일

신유준; 박재형; 김종훈; 권병기; 은희현; 최석민; 안승영, 한국전자파학회 논문지, v.30, no.9, pp.754 - 761, 2019-11

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