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A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; et al, MICROMACHINES, v.13, no.7, 2022-07 |
Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board Song, Kyunghwan; Kim, Jongwook; Kim, Hyunwoong; Lee, Seonghi; Ahn, Jangyong; Brito, Andres; Kim, Hyunsik; et al, ELECTRONICS, v.10, no.13, 2021-07 |
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05 |
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