Browse "GT-Journal Papers(저널논문)" by Subject TSV
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| Rigorous mathematical model of through-silicon via capacitance Kim, Kibeom; Kim, Jedok; Kim, Hongkyun; Ahn, Seungyoung, IET CIRCUITS DEVICES & SYSTEMS, v.12, no.5, pp.589 - 593, 2018-09 |
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Type
- 629 Article
Open Access
- 52 OA Article
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- 247 2020 - 2024
- 342 2010 - 2019
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Subject
- 30 wireless power transfer (WPT)
- 22 DESIGN
- 20 Topology optimization
- 18 Optimization
- 11 SYSTEM