GT-Journal Papers(저널논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 361 to 368 of 368

361
A new single-stage PFC AC/DC converter with low link-capacitor voltage

Lee, Byoung-Hee; Kim, Chong-Eun; Park, Ki-Bumresearcher; Moon, Gun-Wooresearcher, JOURNAL OF POWER ELECTRONICS, v.7, pp.328 - 335, 2007-10

362
Voltage oscillation reduction technique for phase-shift full-bridge converter

Park, Ki-Bumresearcher; Kim, Chong-Eun; Moon, GunWooresearcher; Youn, Myung Joongresearcher, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.54, no.5, pp.2779 - 2790, 2007-10

363
A Double-Ended ZVS Half-Bridge Zeta Converter

Park, Ki Bumresearcher; Kim, Chong-Eun; Moon, GunWooresearcher; Youn, Myung Joongresearcher, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.23, pp.2838 - 2846, 2008-11

364
Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement

Lee, Jungho; Ahn, Seungyoungresearcher; Kwon, Woon-Seong; Paik, Kyung-Wookresearcher; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09

365
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm

Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoungresearcher; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wookresearcher; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09

366
RF interconnect for multi-Gbit/s board-level clock distribution

Ryu, Woonghwan; Lee, Junwoo; Kim, Hyungsoo; Ahn, Seungyoungresearcher; Kim, Namhoon; Choi, Baekkyu; Kam, Donggun; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.398 - 407, 2000-08

367
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoungresearcher; Kim, Jounghoresearcher; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12

368
Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

Ahn, Seungyoungresearcher; Lee, Junho; Kim, Jounghoresearcher; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02

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