Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Young Soon | ko |
| dc.contributor.author | Shin, Ji-Won | ko |
| dc.contributor.author | Choi, Yong-Won | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2019-04-15T15:14:26Z | - |
| dc.date.available | 2019-04-15T15:14:26Z | - |
| dc.date.created | 2014-07-25 | - |
| dc.date.created | 2014-07-25 | - |
| dc.date.issued | 2014-05-28 | - |
| dc.identifier.citation | The 64th Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/254827 | - |
| dc.language | English | - |
| dc.publisher | The 64th Electronic Components and Technology Conference | - |
| dc.title | Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-84907899877 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 64th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, Young Soon | - |
| dc.contributor.nonIdAuthor | Shin, Ji-Won | - |
| dc.contributor.nonIdAuthor | Choi, Yong-Won | - |
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