Browse "GT-Conference Papers(학술회의논문)" by Author Kim, Hyunsik
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| Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM) Kim, Hyun Woong; Kim, Jongwook; Song, Kyunghwan; Lee, Seonghi; Kim, Keunwoong; Kim, Seongguk; Lho, Daehwan; et al, Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE Electronics Packaging Society, 2021-10 |
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- 570 Conference
Date issued
- 228 2020 - 2023
- 313 2010 - 2019
- 25 2000 - 2009
- 4 1997 - 1999