Browse "Cho Chun Shik Graduate School for Mobility(조천식모빌리티대학원)" by Author Cho, Jaeyong

Showing results 1 to 12 of 12

1
A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component

Lee, Sanguk; Kim, Hyunwoong; Ahn, Jangyong; Rhee, Jaewon; Cho, Jaeyong; Kim, Hongseok; Ahn, Seungyoung, IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, v.73, 2024

2
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory

Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; et al, MICROMACHINES, v.13, no.7, 2022-07

3
A Two-Line Time-Domain Gating Method for Characterization of Test Fixture With via Hole Discontinuity

Cho, Jaeyong; Kim, Byung-Sung; Jeong, Jonghyuk; Kim, Junseong; Kim, Kibeom; Hwang, Karam; Lee, Hwiseob; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.27, no.10, pp.936 - 938, 2017-10

4
An Autonomous Coil Alignment System for the Dynamic Wireless Charging of Electric Vehicles to Minimize Lateral Misalignment

Hwang, Karam; Cho, Jaeyong; Kim, Dongwook; Park, Jaehyoung; Kwon, Jong Hwa; Kwak, Sang Il; Park, Hyun Ho; et al, ENERGIES, v.10, no.3, 2017-03

5
An Autonomous Steering System for Wireless Charging Electric Vehicles to Minimize Power Degradation

Hwang, Karam; Cho, Jaeyong; Park, Jaehyoung; Kim, Dongwook; Kwon, Jong Hwa; Kwak, Sang Il; Park, Hyun Ho; et al, 2016 Asia-Pacific World Congress on Computer Science and Engineering and Asia-Pacific World Congress on Engineering, APWC on CSE/APWCE 2016, pp.60 - 65, Institute of Electrical and Electronics Engineers Inc., 2017-12

6
An Efficient Extrapolation Method of Band-limited S-parameters for Extracting Causal Impulse Responses

Cho, Jaeyong; Hwang, Karam; Jeung, Seungil; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, v.38, no.11, pp.2086 - 2098, 2019-11

7
E-field induced keep-out zone determination method of through-silicon vias for 3-D ICs

Kim, Kibeom; Choi, Junsung; Woo, Seongho; Cho, Jaeyong; Ahn, Seungyoung, MICROELECTRONICS RELIABILITY, v.98, pp.161 - 164, 2019-07

8
Fast eye-diagram estimation of high-speed channel based on computationally efficient time response extraction = 연산 효율이 개선된 시간 응답 추출 기반 고속 채널의 아이다이어그램 예측 기법link

Cho, Jaeyong; Ahn, Seungyoung; et al, 한국과학기술원, 2019

9
Ferrite Position Identification System Operating With Wireless Power Transfer for Intelligent Train Position Detection

Hwang, Karam; Cho, Jaeyong; Park, Jaehyoung; Har, Dongsoo; Ahn, Seungyoung, IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS, v.20, no.1, pp.374 - 382, 2019-01

10
Low- and High-Frequency Extrapolation of Band-Limited Frequency Responses to Extract Delay Causal Time Responses

Cho, Jaeyong; Ahn, Jangyong; Kim, Jongwook; Park, Jaehyoung; Shin, Yujun; Kim, Kibeom; Choi, Junsung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.888 - 901, 2021-06

11
Planar multiresonance reactive shield for reducing electromagnetic interference in portable wireless power charging application

Park, Jaehyoung; Park, Chanjun; Shin, Yujun; Kim, Dongwook; Park, Bumjin; Cho, Jaeyong; Choi, Junsung; et al, APPLIED PHYSICS LETTERS, v.114, no.20, 2019-05

12
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

rss_1.0 rss_2.0 atom_1.0