Browse "ME-Theses_Ph.D.(박사논문) " by Subject Semiconductor pacakge▼aWarpage▼aBonding temperature▼aSurface heating element▼aMachine learning
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| (A) study on the cure process for epoxy molding compound to enhance the reliability of semiconductor package = 반도체 패키지의 신뢰성 향상을 위한 에폭시 몰딩 컴파운드의 경화 공정에 관한 연구link Park, Seong Yeon; Kim, Seong Su; et al, 한국과학기술원, 2022 |
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- 1,858 Thesis(Ph.D)