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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Development of a nondestructive miniature X-ray system for the inspection of through silicon via in 3-dimensional stacked semi-conductor packaging = 3차원 적층형 반도체 패키징의 Through Silicon Via 결함 검사용 소형 X-선 비파괴검사장비 개발link Kim, Hyun-Nam; Cho, Sung Oh; 조성오, 한국과학기술원, 2020 |
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