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Results 1-1 of 1 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Polishing process of silicon wafer using silica dispersion = 실리카 분산을 이용한 실리콘 웨이퍼의 연마공정link

Bae, Sun-Hyuck; 배선혁; Yang, Seung-Man; Kim, Do-Hyun; 양승만; 김도현, 한국과학기술원, 1999

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