DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, JS | ko |
dc.contributor.author | Jun, BH | ko |
dc.contributor.author | Lee, EJ | ko |
dc.contributor.author | Hwang, CY | ko |
dc.contributor.author | Lee, Won-Jong | ko |
dc.date.accessioned | 2011-09-20T01:53:18Z | - |
dc.date.available | 2011-09-20T01:53:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1997-01 | - |
dc.identifier.citation | THIN SOLID FILMS, v.292, no.1-2, pp.124 - 129 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://hdl.handle.net/10203/25249 | - |
dc.description.abstract | TiN thin films were prepared by both r.f. plasma enhanced chemical vapor deposition (r.f.-PECVD) and electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) using TiCl4, N-2 and H-2 as the reactants at various deposition temperatures. The effects of deposition temperature on the compositional ratio [N]/[Ti], impurity content, crystallinity, lattice parameter, grain size, deposition rate, resistivity and step coverage were studied. TiN films prepared by ECR-PECVD were highly crystallized at a low temperature of 350 degrees C, while TiN films prepared by r.f.-PECVD began to show obvious crystallinity above 500 degrees C. TiN films deposited by ECR-PECVD at lower temperatures had lower impurity contents and lower resistivity than those deposited by r.f.-PECVD. | - |
dc.description.sponsorship | This research was performed within the 'Studies on Advanced Basic Technology' for future microelectronics project of Korean Electronics and Telecommunications Research Institute. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | ELSEVIER SCIENCE SA LAUSANNE | - |
dc.title | A comparative study on the properties of TiN films prepared by chemical vapor deposition enhanced by rf plasma and by electron cyclotron resonance plasma | - |
dc.type | Article | - |
dc.identifier.wosid | A1997WK35900019 | - |
dc.identifier.scopusid | 2-s2.0-0031553460 | - |
dc.type.rims | ART | - |
dc.citation.volume | 292 | - |
dc.citation.issue | 1-2 | - |
dc.citation.beginningpage | 124 | - |
dc.citation.endingpage | 129 | - |
dc.citation.publicationname | THIN SOLID FILMS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Lee, Won-Jong | - |
dc.contributor.nonIdAuthor | Kim, JS | - |
dc.contributor.nonIdAuthor | Jun, BH | - |
dc.contributor.nonIdAuthor | Lee, EJ | - |
dc.contributor.nonIdAuthor | Hwang, CY | - |
dc.type.journalArticle | Article | - |
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