Large Grain Ruthenium for Alternative Interconnects
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, Seong Jun | ko |
| dc.contributor.author | Lee, SangJae | ko |
| dc.contributor.author | Lee, Tae In | ko |
| dc.contributor.author | Yoon, Alexander | ko |
| dc.contributor.author | Cho, Byung-Jin | ko |
| dc.date.accessioned | 2019-03-19T01:55:07Z | - |
| dc.date.available | 2019-03-19T01:55:07Z | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.created | 2018-11-28 | - |
| dc.date.issued | 2019-01 | - |
| dc.identifier.citation | IEEE ELECTRON DEVICE LETTERS, v.40, no.1, pp.91 - 94 | - |
| dc.identifier.issn | 0741-3106 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/251848 | - |
| dc.description.abstract | We demonstrate Ru wires with more than 4.6× larger grain sizes, with over 30% reduction in resistivity at highly scaled wire areas down to 68 nm2, compared to conventional damascene Ru wires. A method of transferring the extraordinarily large grain structures from thick Ru films to wires is presented. Suppressed grain-boundary scattering in the Ru wires is attributed to the low resistivity, which is analyzed using semi-classical resistivity model. The results strongly support Ru as a candidate alternative interconnect material to replace Cu. | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Large Grain Ruthenium for Alternative Interconnects | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000456172600023 | - |
| dc.identifier.scopusid | 2-s2.0-85056333174 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 40 | - |
| dc.citation.issue | 1 | - |
| dc.citation.beginningpage | 91 | - |
| dc.citation.endingpage | 94 | - |
| dc.citation.publicationname | IEEE ELECTRON DEVICE LETTERS | - |
| dc.identifier.doi | 10.1109/LED.2018.2879932 | - |
| dc.contributor.localauthor | Cho, Byung-Jin | - |
| dc.contributor.nonIdAuthor | Yoon, Alexander | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | Interconnects | - |
| dc.subject.keywordAuthor | alternative metals | - |
| dc.subject.keywordAuthor | Ruthenium | - |
| dc.subject.keywordAuthor | subtractive etch | - |
| dc.subject.keywordAuthor | etch-back | - |
| dc.subject.keywordAuthor | Cu | - |
| dc.subject.keywordPlus | RESISTIVITY | - |
| dc.subject.keywordPlus | FILMS | - |
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