Suppression of Self-Heating Effects in 3-D V-NAND Flash Memory Using a Plugged Pillar-Shaped Heat Sink
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Jun-Young | ko |
| dc.contributor.author | Yun, Dae-Hwan | ko |
| dc.contributor.author | Kim, Seong-Yeon | ko |
| dc.contributor.author | Choi, Yang-Kyu | ko |
| dc.date.accessioned | 2019-03-19T01:05:19Z | - |
| dc.date.available | 2019-03-19T01:05:19Z | - |
| dc.date.created | 2019-02-18 | - |
| dc.date.created | 2019-02-18 | - |
| dc.date.issued | 2019-02 | - |
| dc.identifier.citation | IEEE ELECTRON DEVICE LETTERS, v.40, no.2, pp.212 - 215 | - |
| dc.identifier.issn | 0741-3106 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/251503 | - |
| dc.description.abstract | Self-heating effects (SHEs) in 3-DV-NAND flash memory are investigated using simulations. First, temperature increase is estimated during the read operation, and a hot spot region along the bit-line is identified. Then, a novel bilayered macaroni filler is proposed to relieve the SHEs. A highly thermally conductive layer is plugged into the macaroni oxide filler as a heat sink. The heat dissipation efficiency is improved by up to 21% in the proposed structure. As a result, the reliability issues induced by SHEs can be avoided in V-NAND flash. | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Suppression of Self-Heating Effects in 3-D V-NAND Flash Memory Using a Plugged Pillar-Shaped Heat Sink | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000457606300014 | - |
| dc.identifier.scopusid | 2-s2.0-85058991877 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 40 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 212 | - |
| dc.citation.endingpage | 215 | - |
| dc.citation.publicationname | IEEE ELECTRON DEVICE LETTERS | - |
| dc.identifier.doi | 10.1109/LED.2018.2889037 | - |
| dc.contributor.localauthor | Choi, Yang-Kyu | - |
| dc.contributor.nonIdAuthor | Yun, Dae-Hwan | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | Flashmemory | - |
| dc.subject.keywordAuthor | heat dissipation | - |
| dc.subject.keywordAuthor | heat sink | - |
| dc.subject.keywordAuthor | macaroni filler | - |
| dc.subject.keywordAuthor | reliability | - |
| dc.subject.keywordAuthor | self-heating | - |
| dc.subject.keywordAuthor | 3-dimensional (3D) V-NAND | - |
| dc.subject.keywordPlus | THERMAL-CONDUCTIVITY | - |
| dc.subject.keywordPlus | TRANSPORT | - |
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