DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, Il Seob | ko |
dc.contributor.author | Song, Tae-Ho | ko |
dc.date.accessioned | 2011-09-06T01:10:57Z | - |
dc.date.available | 2011-09-06T01:10:57Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-02 | - |
dc.identifier.citation | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER , v.52, no.5-6, pp.1276 - 1283 | - |
dc.identifier.issn | 0017-9310 | - |
dc.identifier.uri | http://hdl.handle.net/10203/25105 | - |
dc.description.abstract | Advent of micro thermal devices such as lab-on-a-chip and micro heat pump necessitates development of highly effective insulation chips or layers. This paper reports the development of a vacuum insulation chip (VIC) having very low effective thermal conductivity and very small thickness. Fifty nanometer thickness metal coating on both sides of an LCD glass chip and 5 mu m vacuum gap are stacked in a series to decrease the heat transfer by radiation. An array of support legs is necessary to maintain the structure under the atmospheric pressure. Design of VIC involves trade-offs between the heat conduction through the multi-layer structure and the mechanical strength. A model to determine the actual design values is proposed. The results are in reasonable agreement with the more refined results using commercial numerical codes. Based on these results, a VIC of 32 x 32 x 1.88 mm(3) is manufactured, and the effective thermal conductivity is measured by guarded hot plate method. The chip shows effective thermal conductivities of 0.0015 and 0.001 W/m K at vacuum levels of 1.33 and 0.24 Pa (N/m(2)), respectively. (C) 2008 Elsevier Ltd. All rights reserved. | - |
dc.description.sponsorship | This work was supported by the Korea Science and Engineering foundation (KOSEF) grant funded by the Korea government (MOST) (No. R01-2005-000-10682-0 (2007)) and the second stage of the Brain Korea 21 Project in 2007. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | MULTILAYER THERMAL INSULATIONS | - |
dc.title | Development of a multiple layer vacuum insulation chip | - |
dc.type | Article | - |
dc.identifier.wosid | 000263385700022 | - |
dc.identifier.scopusid | 2-s2.0-58149483722 | - |
dc.type.rims | ART | - |
dc.citation.volume | 52 | - |
dc.citation.issue | 5-6 | - |
dc.citation.beginningpage | 1276 | - |
dc.citation.endingpage | 1283 | - |
dc.citation.publicationname | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Song, Tae-Ho | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | MULTILAYER THERMAL INSULATIONS | - |
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