Thermal Resistance of Cycloaliphatic Epoxy Hybrimer Based on Sol-Gel Derived Oligosiloxane for LED Encapsulation

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Cycloaliphatic epoxy hybrimer bulk was successfully fabricated by thermal curing of cycloaliphatic epoxy oligosiloxane resin synthesized by a sot-gel condensation reaction with methylhexahydrophthalic anhydride (MHHPA) and tetrabutylphosphonium methanesulfonate (TBPM). The composition of MHHPA and TBPM in the resin was optimized to minimize yellowness of the cycloaliphatic epoxy hybrimer bulk. The sample with the optimized composition showed little discoloration upon thermal aging at 120 degrees C for 360 h under an air atmosphere. On the basis of its high thermal stability with appropriate hardness and a high refractive index of 1.55, cycloaliphatic epoxy hybrimer bulk can be used as a LED encapsulant for white LEDs.
Publisher
Wiley-Blackwell
Issue Date
2010-08-15
Keywords

oligomers; transparency; light-emitting diodes (LED); UV-vis spectroscopy; differential scanning calorimetry (DSC)

Citation

Journal of Applied Polymer Science, Vol.117, pp.2140-2145

ISSN
0021-8995
DOI
10.1002/app.31702
URI
http://hdl.handle.net/10203/25103
Appears in Collection
MS-Conference Papers(학술회의논문)

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