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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Experimental analysis on the mechanism of moisture induced interface weakening in ACF package

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dc.contributor.authorSim, Gidongko
dc.contributor.authorChung, CKko
dc.contributor.authorPaik, KWko
dc.contributor.authorLee, Soon-Bokko
dc.date.accessioned2011-08-04T05:09:46Z-
dc.date.available2011-08-04T05:09:46Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2009-06-15-
dc.identifier.citationEuropean Microelectronics and Packaging Conference, EMPC 2009-
dc.identifier.urihttp://hdl.handle.net/10203/24739-
dc.description.sponsorshipThis work was financially supported by the Fundamental R&D Program for Core Technology of Materials funded by the Ministry of Knowledge Economy, Republic of Korea.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherEuropean Microelectronics and Packaging Conference, EMPC 2009-
dc.titleExperimental analysis on the mechanism of moisture induced interface weakening in ACF package-
dc.typeConference-
dc.identifier.wosid000274631600062-
dc.identifier.scopusid2-s2.0-70449817465-
dc.type.rimsCONF-
dc.citation.publicationnameEuropean Microelectronics and Packaging Conference, EMPC 2009-
dc.identifier.conferencecountryIT-
dc.identifier.conferencelocationRimini-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorSim, Gidong-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorChung, CK-
dc.contributor.nonIdAuthorPaik, KW-
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ME-Conference Papers(학술회의논문)
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