Introduction to the Special Section on the 2017 Asian Solid-State Circuits Conference (A-SSCC)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lin, Tsung-Hsien | ko |
| dc.contributor.author | Yang, Chia-Hsiang | ko |
| dc.contributor.author | Ryu, Seung-Tak | ko |
| dc.date.accessioned | 2018-11-12T04:19:19Z | - |
| dc.date.available | 2018-11-12T04:19:19Z | - |
| dc.date.created | 2018-10-22 | - |
| dc.date.created | 2018-10-22 | - |
| dc.date.created | 2018-10-22 | - |
| dc.date.issued | 2018-10 | - |
| dc.identifier.citation | IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.53, no.10, pp.2739 - 2740 | - |
| dc.identifier.issn | 0018-9200 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/246329 | - |
| dc.description.abstract | This issue of the IEEE Journal of Solid-State Circuits (JSSC) includes some of the highlights of the best papers from the 2017 Asian Solid-State Circuits Conference (A-SSCC), which was held at the Grand Hilton Hotel, Seoul, South Korea, on November 6–8, 2017. | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Introduction to the Special Section on the 2017 Asian Solid-State Circuits Conference (A-SSCC) | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000446116400001 | - |
| dc.identifier.scopusid | 2-s2.0-85054545005 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 53 | - |
| dc.citation.issue | 10 | - |
| dc.citation.beginningpage | 2739 | - |
| dc.citation.endingpage | 2740 | - |
| dc.citation.publicationname | IEEE JOURNAL OF SOLID-STATE CIRCUITS | - |
| dc.identifier.doi | 10.1109/JSSC.2018.2865839 | - |
| dc.contributor.localauthor | Ryu, Seung-Tak | - |
| dc.contributor.nonIdAuthor | Lin, Tsung-Hsien | - |
| dc.contributor.nonIdAuthor | Yang, Chia-Hsiang | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Editorial Material | - |
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