An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Cited 20 time in webofscience Cited 0 time in scopus
  • Hit : 258
  • Download : 130
The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.
Publisher
MDPI
Issue Date
2018-07
Language
English
Article Type
Review
Citation

SENSORS, v.18, no.7

ISSN
1424-8220
DOI
10.3390/s18071981
URI
http://hdl.handle.net/10203/245933
Appears in Collection
CE-Journal Papers(저널논문)
Files in This Item
106246.pdf(10.6 MB)Download
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 20 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0