DC Field | Value | Language |
---|---|---|
dc.contributor.author | Remmert, Jessica L. | ko |
dc.contributor.author | Wu, Yan | ko |
dc.contributor.author | Lee, Jungchul | ko |
dc.contributor.author | Shannon, Mark A. | ko |
dc.contributor.author | King, William P. | ko |
dc.date.accessioned | 2018-09-18T06:02:24Z | - |
dc.date.available | 2018-09-18T06:02:24Z | - |
dc.date.created | 2018-08-21 | - |
dc.date.created | 2018-08-21 | - |
dc.date.issued | 2007-10 | - |
dc.identifier.citation | APPLIED PHYSICS LETTERS, v.91, no.14 | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.uri | http://hdl.handle.net/10203/245498 | - |
dc.description.abstract | This letter reports contact potential measurement between the tip of a heated atomic force microscope cantilever and a biased gold film. Force-distance experiments were performed with tip temperature, tip potential, and substrate potential independently controlled. Experiments were conducted for probe temperatures of 23 to 200 degrees C and tip potentials of -1 V to 1 V. The measured contact potential was a function of temperature, due to the thermoelectric properties of the tip and substrate. The Seebeck coefficient for the combined system was close to -4.30 mV/K, consistent with the tip and substrate materials. The technique is scalable to arrays suitable for large area imaging. (c) 2007 American Institute of Physics. | - |
dc.language | English | - |
dc.publisher | AMER INST PHYSICS | - |
dc.subject | THERMOELECTRIC-POWER | - |
dc.subject | DATA-STORAGE | - |
dc.subject | SENSORS | - |
dc.subject | SILICON | - |
dc.subject | SURFACE | - |
dc.subject | CANTILEVERS | - |
dc.subject | JUNCTIONS | - |
dc.title | Contact potential measurement using a heated atomic force microscope tip | - |
dc.type | Article | - |
dc.identifier.wosid | 000249974100101 | - |
dc.identifier.scopusid | 2-s2.0-34948890144 | - |
dc.type.rims | ART | - |
dc.citation.volume | 91 | - |
dc.citation.issue | 14 | - |
dc.citation.publicationname | APPLIED PHYSICS LETTERS | - |
dc.identifier.doi | 10.1063/1.2789927 | - |
dc.contributor.localauthor | Lee, Jungchul | - |
dc.contributor.nonIdAuthor | Remmert, Jessica L. | - |
dc.contributor.nonIdAuthor | Wu, Yan | - |
dc.contributor.nonIdAuthor | Shannon, Mark A. | - |
dc.contributor.nonIdAuthor | King, William P. | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | THERMOELECTRIC-POWER | - |
dc.subject.keywordPlus | DATA-STORAGE | - |
dc.subject.keywordPlus | SENSORS | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | SURFACE | - |
dc.subject.keywordPlus | CANTILEVERS | - |
dc.subject.keywordPlus | JUNCTIONS | - |
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