DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Suhyeong | ko |
dc.contributor.author | Shim, Seongbo | ko |
dc.contributor.author | Shin, Youngsoo | ko |
dc.date.accessioned | 2018-08-21T04:40:12Z | - |
dc.date.available | 2018-08-21T04:40:12Z | - |
dc.date.created | 2018-08-20 | - |
dc.date.created | 2018-08-20 | - |
dc.date.issued | 2018-08 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.65, no.8, pp.1044 - 1048 | - |
dc.identifier.issn | 1549-7747 | - |
dc.identifier.uri | http://hdl.handle.net/10203/245185 | - |
dc.description.abstract | Electrothermal analogy allows heat conduction and heat convection to be modeled as a simple resistive or RC network. A practical environment in which a chip is located is often not purely convective. Nonetheless, the environment is typically approximated as convective for simplicity of analysis. This yields inaccuracy of temperature estimation; ad hoc calibration process is necessary to match estimation and measurement by empirically adjusting thermal parameters. In this brief: 1) we extract electrothermal analogy through mathematical derivation and 2) this allows us to understand how the basic resistive network can be modified to handle non-convective environment accurately. The new network is applied in the estimation of steady-state and transient temperature as well as in thermal design power. A smartphone under the sunlight is assumed as an example of non-convective environment. Estimation of steady-state temperature using our network is compared to actual measurement, which demonstrates its accuracy. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | SIMULATION | - |
dc.subject | DESIGN | - |
dc.title | Electrothermal Analysis With Nonconvective Boundary Conditions | - |
dc.type | Article | - |
dc.identifier.wosid | 000440693200016 | - |
dc.identifier.scopusid | 2-s2.0-85041799979 | - |
dc.type.rims | ART | - |
dc.citation.volume | 65 | - |
dc.citation.issue | 8 | - |
dc.citation.beginningpage | 1044 | - |
dc.citation.endingpage | 1048 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | - |
dc.identifier.doi | 10.1109/TCSII.2018.2805186 | - |
dc.contributor.localauthor | Shin, Youngsoo | - |
dc.contributor.nonIdAuthor | Choi, Suhyeong | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Electrothermal analogy | - |
dc.subject.keywordAuthor | thermal analysis | - |
dc.subject.keywordPlus | SIMULATION | - |
dc.subject.keywordPlus | DESIGN | - |
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