A D-band CMOS Power Amplifier for Wireless Chip-to-Chip Communications with 22.3 dB Gain and 12.2 dBm P1dB in 65-nm CMOS Technology

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This paper presents a D-band linearized power amplifier (PA) with on-chip current combining transformer using a standard 65nm CMOS process, which covers 114 to 131 GHz. To mitigate the parasitic gate-drain capacitance feedback, each stage consists of common source (CS) amplifier with a neutralization using cross-coupled capacitor (Cc). The PA achieves a small-signal gain of 22.3 dB and 3-dB bandwidth (BW) of 17 GHz, a 1-dB compressed power (P1dB) of 12.2 dBm and a saturated output power (PSAT) of 14.5 dBm with a peak PAE of 10.2%. The PA chip area is 0.343mm(2) including the pads and the core chip area is 0.103mm(2).
Publisher
RWW 2018
Issue Date
2018-01
Language
English
Citation

2018 IEEE Topical Conference on RF/Microwave Power Amplifiers for Radio and Wireless Applications (PAWR), pp.35 - 38

DOI
10.1109/PAWR.2018.8310061
URI
http://hdl.handle.net/10203/243653
Appears in Collection
EE-Conference Papers(학술회의논문)
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