Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems

Abstract

With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based systems is more important than ever. In addition to ongoing challenges to achieve higher integration density along with maintaining electrical integrity, multiphysics and low-power design requirements should be addressed. In order to provide solutions for upcoming applications and design challenges, novel ideas on design as well as advanced modeling approaches are continuously demanded.