DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박철순 | ko |
dc.date.accessioned | 2017-12-20T12:48:50Z | - |
dc.date.available | 2017-12-20T12:48:50Z | - |
dc.date.issued | 2011-09-20 | - |
dc.identifier.uri | http://hdl.handle.net/10203/236519 | - |
dc.description.abstract | A wireless communication module includes a plurality of monolithic millimeter-wave integrated circuits (MMICs) for signal processing attached to the top surface of a multi-layer low temperature co-fired ceramic substrate; a planar transmission line formed on the top surface of the multi-layer substrate for communications between the MMICs; a metal base attached to the bottom surface of the multi-layer substrate and having an opening to which an antenna is attached; a plurality of vias for connecting the metal base and the planar transmission line within the multi-layer substrate to establish a uniform potential on a ground plane of the multi-layer substrate; an embedded waveguide formed in the opening surrounded with the vias within the multi-layer substrate; and a planar transmission line-to-waveguide transition apparatus for the transition of waves between the planar transmission line and the embedded waveguide. | - |
dc.title | Planar transmission line-to-waveguide transition apparatus having an embedded bent stub | - |
dc.title.alternative | 평판전송선로와 도파관 사이의 변환장치 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 박철순 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 12433116 | - |
dc.identifier.patentRegistrationNumber | 08022784 | - |
dc.date.application | 2009-04-30 | - |
dc.date.registration | 2011-09-20 | - |
dc.publisher.country | US | - |
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