Browse "RIMS Collection" by Author Nie, Lei
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| Void control in adhesive bonding using thermosetting polymer Nie, Lei; Lee, Kiwon; Lee, Sangyong; Shi, Tielin; Liao, Guanglan, SENSORS AND ACTUATORS A-PHYSICAL, v.167, no.2, pp.398 - 405, 2011-06 |
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