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Development of a High-Strength and Good-Stiffness Cu-base Alloy y.g. kim; t.j. cho; i.d.kim, METALLURGICAL TRANSACTIONS, v.22, pp.256 - 258, 1991 |
The Effect of Descaling Treatments on Intermetallic Formation and Thermomechanical Stability of an Electroplated Tin/Lead Layer in a Semiconductor Leadframe Alloy y.g. kim; t.y. chung; t.j. cho, JOURNAL OF MATERIALS SCIENCE LETTERS, v.13, pp.1465 - 1468, 1994 |
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