Apparatus for measuring stress in a thin film and method of manufacturing a probe used therefor

Abstract

The present invention relates to an apparatus for measuring stress in a thin film and method of manufacturing a probe used therefor. The stress measurement apparatus of the present invention comprises a light source unit, a sensor unit which introduces light from the light source to the backside of a substrate and introduces the light reflected therefrom to a photodetector, a photodetector, and a unit which processes the intensity of detected light through an amplification. The sensor unit is a fiber-optic bundle probe which comprises a plurality of input optical-fiber strands, a plurality of output optical-fiber strands that are placed symmetrically around each of the input optical-fiber strands, and a capillary tube for integrating these optical-fiber strands by inserting them therein. In the arrangement of the optical-fiber strands, a simulation program can be used which simulates the experimental results for the best sensitivity. According to this invention, the stress unavoidably induced during the thin film deposition can be measured in an ultrahigh sensitivity on a real-time basis.