DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이대길 | ko |
dc.contributor.author | 진우석 | ko |
dc.contributor.author | 황희윤 | ko |
dc.contributor.author | 이승민 | ko |
dc.contributor.author | 김병철 | ko |
dc.contributor.author | 권재욱 | ko |
dc.date.accessioned | 2017-12-20T11:14:11Z | - |
dc.date.available | 2017-12-20T11:14:11Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/233652 | - |
dc.description.abstract | A method is disclosed for testing bonded part integrity of bonded structures with increased sensitivity and in a nondestructive manner. The method includes the steps of: mixing a piezoelectric material or an electrically conductive material with an adhesive agent, curing the adhesive agent in between bonding target objects, electrically connecting the bonding target objects to one another, causing an electric current to flow through the bonding target objects to measure a quantity of electric charges flowing between the bonding target objects, and determining existence of bonding damage between the bonding target objects and the adhesive agent based on the quantity of electric charges and predicting a remaining life span of the bonded structures based on a data indicating a correlation between the quantity of electric charges and a predetermined fatigue life. | - |
dc.title | Nondestructive reliability monitoring method for adhesively bonded structures whose sensitivity is improved by using piezoelectric or conductive materials | - |
dc.title.alternative | 압전 재료 혹은 전도성 재료를 이용하여 민감도가 향상된 접합 구조물의 접합부 안전성 검사방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 이대길 | - |
dc.contributor.nonIdAuthor | 진우석 | - |
dc.contributor.nonIdAuthor | 황희윤 | - |
dc.contributor.nonIdAuthor | 이승민 | - |
dc.contributor.nonIdAuthor | 김병철 | - |
dc.contributor.nonIdAuthor | 권재욱 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 11752159 | - |
dc.identifier.patentRegistrationNumber | 7589457 | - |
dc.date.application | 2007-05-22 | - |
dc.date.registration | 2009-09-15 | - |
dc.publisher.country | US | - |
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