DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Soohyun | ko |
dc.contributor.author | Lee, Jun Sok | ko |
dc.contributor.author | Choi, Jai Seong | ko |
dc.contributor.author | Kang, Gyung Soo | ko |
dc.date.accessioned | 2017-12-20T11:13:13Z | - |
dc.date.available | 2017-12-20T11:13:13Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/233613 | - |
dc.description.abstract | Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution having conductivity is placed on the top surface of the glass plate by means of surface tension. Means for moving reciprocally a base material having conductivity in opposite direction is provided. A carbon nano-tube is adhered to a pointed tip of the base material by means of an adhesive. An end portion of the carbon nano-tube is to be immersed in the electrolytic solution. A power supply is provided for applying an electric power to the electrolytic solution and the base material. | - |
dc.title | Apparatus for and method of bonding nano-tip using electrochemical etching | - |
dc.title.alternative | 전해에칭을 이용한 나노팁의 접착장치 및방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Kim, Soohyun | - |
dc.contributor.nonIdAuthor | Lee, Jun Sok | - |
dc.contributor.nonIdAuthor | Choi, Jai Seong | - |
dc.contributor.nonIdAuthor | Kang, Gyung Soo | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 11138772 | - |
dc.identifier.patentRegistrationNumber | 7452435 | - |
dc.date.application | 2005-05-26 | - |
dc.date.registration | 2008-11-18 | - |
dc.publisher.country | US | - |
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