Fabrication method of flexible devices플렉시블 소자의 제작 방법
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 배병수 | ko |
| dc.contributor.author | 진정호 | ko |
| dc.date.accessioned | 2017-12-20T10:51:38Z | - |
| dc.date.available | 2017-12-20T10:51:38Z | - |
| dc.date.issued | 2014-08-12 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/232945 | - |
| dc.description.abstract | Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate so that regions with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film on the surface-treated carrier plate, forming thin film patterns on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique. | - |
| dc.title | Fabrication method of flexible devices | - |
| dc.title.alternative | 플렉시블 소자의 제작 방법 | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | 배병수 | - |
| dc.contributor.nonIdAuthor | 진정호 | - |
| dc.contributor.assignee | KAIST | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 13106124 | - |
| dc.identifier.patentRegistrationNumber | 8801997 | - |
| dc.date.application | 2011-06-14 | - |
| dc.date.registration | 2014-08-12 | - |
| dc.publisher.country | US | - |
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