Fabrication method of flexible devices플렉시블 소자의 제작 방법

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Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate so that regions with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film on the surface-treated carrier plate, forming thin film patterns on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique.
Assignee
KAIST
Country
US (United States)
Issue Date
2014-08-12
Application Date
2011-06-14
Application Number
13106124
Registration Date
2014-08-12
Registration Number
8801997
URI
http://hdl.handle.net/10203/232945
Appears in Collection
MS-Patent(특허)
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